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EA Equipment And Accessories Of Semiconductor Process > EA-05 Die Form

EA-05 Die Form

EA-05 Die Form

Model Number: EA-05

產品描述

Equipment introduction

Suitable for 2.5D and 3D packaging process, used for cleaning flux. DIW can be used in the whole process. The inclination angle of the XYZ axis of the nozzle and the bottom plate of the Boat plate can be adjusted according to the process requirements. It can accurately clean the gap and improve the production capacity. Fully automatic cleaning can be set.

 

Features

EA-05 助焊劑清洗機

≤40μm crevice cleaning

EA-05 助焊劑清洗機

Adjustable nozzle angle

EA-05 助焊劑清洗機

Adjustable base plate inclination

EA-05 助焊劑清洗機

Point cleaning

 

 

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